MPIC 2027 — Malaysia Polymer International Conference 2027 | CFP & Deadlines
MPIC — Malaysia Polymer International Conference 2027 — is a peer-reviewed academic conference in Engineering & Robotics taking place Aug 18–19, 2027 at Bandar Baru Bangi, Malaysia, Bandar Baru Bangi, Malaysia. The event brings together researchers, doctoral candidates, faculty members, and industry practitioners to present original work, exchange ideas, and explore emerging trends shaping the field of Engineering & Robotics. Organized by Malaysia Polymer International Conference and the Polymer Research Center (PORCE), Faculty of Science and Technology, Universiti Kebangsaan Malaysia (UKM). Key topics include Engineering & Robotics Foundations & Frontiers, Methods, Architectures & Applied Systems, Empirical Evaluations & Benchmarks. Paper submission deadline: Jul 15, 2027 (AoE). The technical program typically features keynote addresses from leading experts, full paper presentations, interactive poster sessions, and hands-on workshops or tutorials that balance foundational theory with applied, real-world innovation. Delegates can expect structured opportunities for networking, panel discussions, and cross-disciplinary knowledge exchange with peers from universities, research institutes, and industry across the globe. Authors are invited to submit original, unpublished manuscripts for rigorous peer review, with accepted papers published in the official conference proceedings and made available through recognized academic indexing and citation databases. Whether attending as a first-time presenter or an established scholar, participants gain a valuable platform to showcase research contributions, receive constructive feedback from domain experts, and build lasting professional connections within the Engineering & Robotics research community.
Bandar Baru Bangi, MalaysiaConference Schedule & Location
Dates: to
Host Location: Bandar Baru Bangi, Malaysia (Bandar Baru Bangi, Malaysia)
Official Website: https://www.ukm.my/mpic/
Important Dates & Deadlines (AoE)
- Abstract Submission
- Full Paper Submission
Indexed Research Tracks & Topics
- Engineering & Robotics Foundations & Frontiers
- Methods, Architectures & Applied Systems
- Empirical Evaluations & Benchmarks
- Interdisciplinary & Cross-Domain Applications
Frequently Asked Questions about MPIC 2027
When and where is MPIC 2027?
MPIC 2027 (Malaysia Polymer International Conference 2027) takes place Aug 18–19, 2027 and is held in Bandar Baru Bangi, Malaysia. Format: In-Person.
What is the MPIC 2027 paper submission deadline?
The full paper submission deadline for MPIC 2027 is Jul 15, 2027 (Anywhere on Earth / AoE). Track-specific cutoffs may differ — always confirm on the official Call for Papers.
How do I submit a paper to MPIC 2027?
Authors can submit manuscripts through the official submission portal at https://cmt3.research.microsoft.com/MPIC2027. Review the CFP tracks and formatting guidelines before uploading.
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Journals Accepting Papers in Engineering & Robotics
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IEEE Internet of Things Journal (IEEE IoT-J) • Published by Institute of Electrical and Electronics EngineersImpact Factor: 10.6
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IEEE Access (IEEE Access) • Published by IEEEImpact Factor: 3.9
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IEEE Robotics and Automation Letters (IEEE RA-L) • Published by IEEE Robotics and Automation SocietyImpact Factor: 5.2
Academic Publishing Insights & Research Guides
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📚 The Complete Guide to AoE (Anywhere on Earth) Deadlines in Academic Conferences (2026–2027)
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